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All the GDDR6 sits on the underside of the board, opposite the APU, so the "1.5mm on front of board" recommendation was wrong. There are no VRAM chips on the APU side, that side takes paste on the die. prerequisites.md also listed 1mm/1.5mm while cooling.md and performance.md said 2mm. Standardise on 2mm for the underside memory pads, add a "verify the gap on your board" caveat, drop the phantom front-side pads, and link prerequisites to the cooling procedure so the value lives in one place. Closes #34.